Nextek specializes in precision Printed Circuit Board Assembly (PCBA) of standard through advanced technology products in lot sizes ranging anywhere from 1 to 10,000. We are experts in the assembly of high mix, low-mid volume, and High-Reliability products. Although we have a high degree of competency building advanced electronics assemblies, we also support customers with a variety of assembly needs including Plated Through Hole (PTH), Mixed Technology, Box Build, and System Integration.

Nextek has become a recognized industry leader in PCBA production as a result of the company's investment in its engineering staff and equipment, as well as value-add services, such as a state-of-the-art analytic lab, prototyping services, DFM and PCB design, program management, and supply chain management.


  • IPC/J-STD Class 2 and 3
  • High density interconnect (HDI) assembly
  • High mix/low-mid volume production
  • Rigid, rigid-flex, and flex
  • BGA, uBGA with placement capability down to .3mm
  • Passive components to 0201s and 01005s
  • Water soluble (OA), RMA and no clean/lead and lead-free/RoHS processes
  • Wave solder and selective solder
  • AOI - inline with laser profilometry
  • 100% x-ray of BGA and leadless devices
  • Aegis Industrial Software for WIP tracking data collection and paperless factor routing
  • Juki Placement Platforms (Laser Aligned) with conveyor systems (not modular stand-alone stations), self-feeding, and self-cleaning screen printers with solder paste inspection, glue dispensers, and 10-zone nitrogen purged reflow ovens with KIC profiling
  • Placement accuracy of +/- 30 microns
  • Underfill BGA down to .2mm pitch
  • PCBA ruggedization
  • Conformal coating
  • Deionized water wash system
  • Saponified, self-contained wash system
  • Ionic cleanliness verification
  • Small form factor, high density electronics PCB assembly/standard form factor PCB assembly/large form factor PCB assembly (up to 18x20 inches)