Nextek specializes in precision Printed Circuit Board Assembly (PCBA) of standard through advanced technology products in lot sizes ranging anywhere from 1 to 10,000. We are experts in the assembly of high mix, low-mid volume, and High-Reliability products. Although we have a high degree of competency building advanced electronics assemblies, we also support customers with a variety of assembly needs including Plated Through Hole (PTH), Mixed Technology, Box Build, and System Integration.

Nextek has become a recognized industry leader in PCBA production as a result of the company's investment in its engineering staff and equipment, as well as value-add services, such as a state-of-the-art analytic lab, prototyping services, DFM, program management, and supply chain management.

SERVICES AND BENEFITS INCLUDE:

• IPC/J-STD Class 2 and 3

• High density interconnect (HDI) assembly

• High mix/low-mid volume production

• Rigid, rigid-flex, and flex

• BGA, uBGA with placement capability down to .3mm

• Passive components to 0201s and 01005s

• Water soluble (OA), RMA and no clean/lead and lead-free/RoHS processes

• Wave solder and selective solder

• AOI - inline with laser profilometry

• 100% x-ray of BGA and leadless devices

• Factory Logix Industrial Software for WIP tracking data collection and paperless factor routing

• Juki Placement Platforms (Laser Aligned) with conveyor systems (not modular stand-alone stations), self-feeding, and self-cleaning screen printers with solder paste inspection, glue dispensers, and 10-zone nitrogen purged reflow ovens with KIC profiling

• Placement accuracy of +/- 30 microns

• Underfill BGA down to .2mm pitch

• Inline Solder Paste Inspection Systems

• PCBA ruggedization

• Conformal coating

• Deionized water wash system

• Saponified, self-contained wash system

• Ionic cleanliness verification

• Small form factor, high density electronics PCB assembly/standard form factor PCB assembly/large form factor PCB assembly (up to 18x20 inches)